Major Breakthrough in EUV Light Source: Chip Output Could Skyrocket by 50%

Exciting news from Dutch semiconductor giant ASML: by 2030, each of its advanced chip fabrication machines could handle around 330 wafers per hour, up from today’s 220, potentially boosting chip output by as much as 50%!

ASML is the world’s only commercial manufacturer of Extreme Ultraviolet (EUV) lithography machines, essential tools for companies like TSMC and Intel to produce cutting-edge chips. Michael Purvis, ASML’s Chief EUV Light Source Technologist, emphasized: “This is not a demonstration for show—it’s a fully functional system that can stably deliver 1000 watts in real production environments.”

EUV Light Source Power Increased to 1000 Watts

This breakthrough tackles the most challenging aspect of EUV lithography—high-power, stable light generation. ASML researchers have boosted the EUV light source from 600 watts to 1000 watts, enabling more chips per hour and significantly lowering the cost per chip.

Chip fabrication works similarly to photography: EUV light exposes a silicon wafer coated with photoresist. Higher power means shorter exposure times. Teun van Gogh, Executive VP of ASML NXE EUV Systems, stated: “We aim to allow customers to continuously leverage EUV technology at lower costs.”

330 Wafers Per Hour by 2030

ASML achieved this increase by enhancing key components such as the tin-droplet generator. Molten tin droplets are injected into a chamber, then heated with a high-power CO₂ laser into plasma, generating 13.5 nm wavelength EUV light. Zeiss’ precision optics collect the light and guide it into the lithography machine for chip patterning.

Key innovations include doubling the tin-droplet injection rate to ~100,000 per second and using two short-pulse lasers to generate plasma instead of one. Professor Jorge J. Rocca from Colorado State University remarked: “Achieving 1000 watts is truly remarkable.”

Purvis added: “We already see a clear path to 1500 watts, and physically, 2000 watts is feasible.”

Startups Challenging ASML

Startups like Substrate and xLight are challenging ASML’s dominance. Substrate uses shorter-wavelength X-ray lithography to potentially rival TSMC, while xLight is developing high-power LPP light sources compatible with ASML tools to reduce wafer costs and triple operational efficiency.

This EUV technology race is set to drive the next wave of global semiconductor innovation.