2026年9月10日

繁體中文
登入

Global Wafer Fabrication Capacity Overview

The OECD recently published THE CHIP LANDSCAPE, analyzing global wafer fabrication capacity. As of S...

WEIWEI 2025年12月29日 來源: www.myzaker.com

The OECD recently published THE CHIP LANDSCAPE, analyzing global wafer fabrication capacity. As of September 2025, China, Taiwan, South Korea, Japan, and the U.S. accounted for 87% of global operational wafer capacity.

  • Process Nodes: South Korea’s capacity is concentrated in 6–22nm for memory chips; U.S. capacity is more diversified.
  • Key Companies: The top 10 semiconductor companies account for ~50% of global wafer capacity. Production in Japan, South Korea, and Taiwan is highly concentrated; mainland China is more distributed.
  • Chip Type Capacity:
    • Power/discrete: China leads (6.28M WSPM)
    • Analog: China leads (3.64M WSPM)
    • Mature logic: China leads (4.23M WSPM/month)
    • Advanced logic: Taiwan leads (1.55M WSPM/month)
    • Commodity memory: South Korea leads (4.58M WSPM/month)
    • Specialty memory: Taiwan leads (1.18M WSPM/month)
  • Capacity Expansion:
    • Mainland China: mature logic, power/discrete
    • U.S. & Taiwan: advanced logic
    • South Korea: commodity memory
  • Fab Types:
    • Commodity memory and advanced logic fabs are highly specialized
    • Analog, mature logic, and specialty memory produced in “mixed-technology” fabs
    • Most capacity remains domestic, though foreign fabs are increasing in some regions

Global wafer capacity is concentrated in a few economies and large companies, but chip type, process, and business model create complex distribution and growth potential.

接著讀